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Corintis is a Switzerland-based engineering startup (ranked No. 1 for 2025–2026) offering microfluidic cooling technologies for AI chips, GPUs, and CPUs in data centers. The company employs 110+ people from 35+ nationalities and is headquartered on the EPFL Campus near Lake Geneva.
You will own the product direction of Glacierware, Corintis's cooling design automation platform. Glacierware combines simulation solvers and optimization algorithms to design cold plates co-designed with chips in minutes to hours, and is central to how Corintis works with leading AI chip makers. This is a senior individual-contributor role reporting directly to C-level.
Key responsibilities include:
- Define and communicate a 1–3 year product vision, strategy, and prioritized roadmap for the simulation suite, making clear trade-offs between customer needs, platform investment, technical debt, and quality.
- Own go-to-market strategy and execution of Corintis software products.
- Lead customer discovery through interviews, surveys, workflow shadowing, site visits, and usability testing to validate product opportunities.
- Maintain a single, transparent backlog covering features, bugs, design changes, technical debt, customer requests, and improvements.
- Partner with Engineering from discovery through release, translating customer pain into clear product stories and defining success criteria.
- Lead product communication strategy, positioning, and external-facing materials; represent Corintis at industry events.
- Track market developments in CFD, multiphysics, cloud simulation, EDA/CAD ecosystems, AI-assisted workflows, chiplets, 3D-IC, and advanced packaging.
- Define and report product outcomes including adoption, retention, workflow efficiency, simulation throughput and accuracy, customer satisfaction, and support load.
You will work at the intersection of physics, software, and customers, collaborating with Engineering, Solutions, Sales, Marketing, and Customer Success teams.
REQUIREMENTS:
- Bachelor's or Master's degree in mechanical engineering, thermal engineering, electrical engineering, physics, computational engineering, or closely related field.
- At least 5 years of product management experience with complex technical engineering software, ideally simulation, CFD, or EDA tools.
- Experience taking a product from internal tool or early version to external stakeholders.
- Proven ability to own multi-quarter strategy, roadmaps, and product lifecycle decisions for multidisciplinary teams (solvers, algorithms, software, UI).
- Experience working with software engineering teams on requirements, requirement decomposition, backlog refinement, iteration planning, validation, and release decisions.
- Proven customer-discovery skills and technical credibility to work directly with end users, understand workflows, and balance competing requests.
- Practical knowledge of simulation workflows and tools used in chip, package, or PCB design (e.g., Cadence Celsius, Siemens Flotherm, Ansys Icepak, COMSOL, Altair SimLab). Ability to interpret simulation results and assess model accuracy, mesh quality, material models, and boundary conditions.
- Strong understanding of chip-level thermal engineering, including heat transfer, power dissipation, thermal resistance, hotspot analysis, package- and board-level effects, and coupled thermal-electrical and CFD workflows.
- Understanding of EDA workflows, PCB design, electronics packaging, and how simulation software integrates with CAD and EDA tools.
- Clear written and spoken English and sound judgment under ambiguity.
- Strong interpersonal skills and empathy to work across Product, Engineering, Solutions, Sales, Marketing, and Customer Success; understand each team's perspective, incentives, and constraints; and build alignment.
- Ability to travel without restriction to and within the USA, Canada, and Europe.
