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Salary: USD 190,000 - 250,000 / annual
Exo Imaging is seeking an experienced mixed-signal ASIC designer to join the engineering team developing next-generation medical ultrasound imaging systems. This role focuses on the design and verification of signal processing modules, interfaces, control blocks, and other functions on ASICs interfaced with FPGAs and supporting circuits.
You will work on the full spectrum of ASIC development: circuit design, simulation, verification, layout management, and chip tapeout. Key responsibilities include designing circuits, debugging and characterizing mixed-signal ICs in the lab, developing complex high-precision circuits in CMOS technologies, and supervising layout personnel and laboratory technicians. You will perform design reviews with worst-case analysis and leverage industry-standard tools like Cadence Design Systems to oversee IC layout.
The ideal candidate is self-motivated, prepared to challenge conventional approaches, and brings deep expertise in mixed-signal ASIC and systems development. You will collaborate across functional teams, communicate effectively with senior decision-makers, and demonstrate proven ability to lead or contribute within design teams developing cutting-edge products.
Required qualifications: MSEE with 8+ years of relevant experience; 5+ years in successful commercial product development; hands-on experience with design, simulation, verification, layout management, and chip tapeout; circuit debug and lab bring-up experience with mixed-signal ICs; strong interpersonal skills and ability to influence senior stakeholders; in-depth knowledge of industry best practices.
