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CesiumAstro develops cutting-edge communication systems for satellites, UAVs, launch vehicles, and other space and airborne platforms. The Skylark product line focuses on rapid design, build, and test of active phased array antennas (AESA) for terrestrial and airborne applications, spanning high-power ground terminals for missile defense to commercial airline and helicopter connectivity solutions.
You will lead and develop a team of Mechanical Engineers, fostering a collaborative, innovative, and high-performing engineering culture. Your responsibilities include providing coaching, mentorship, performance feedback, and career development for team members; supporting staffing, hiring, onboarding, and resource allocation across programs and internal R&D efforts; and partnering with program leadership to ensure mechanical engineering activities meet technical, cost, and schedule objectives.
You will develop, implement, and continuously improve mechanical engineering processes, standards, tools, and best practices. You will promote technical excellence through design reviews, engineering guidance, and mentorship, while serving as a senior technical contributor for ruggedized electronics packaging, phased array antenna systems, and communication hardware. You will lead or support concept development, mechanical architecture, detailed design, structural and thermal analysis, manufacturing, integration, environmental qualification, and production transition activities.
Additional responsibilities include supporting proposal development and customer technical discussions, fostering collaboration across Mechanical Engineering, Electrical Engineering, RF, Manufacturing, Quality, Test, and Supply Chain organizations, and promoting CesiumAstro's culture and commitment to continuous improvement.
**REQUIREMENTS:**
- Bachelor of Science degree in Mechanical Engineering or related engineering discipline from an accredited university
- 4–7 years of industry experience as an individual contributor in design and analysis of aerospace, defense, communications, or ruggedized electronics products
- 1+ year of previous leadership or management experience (technical lead, project lead, Responsible Engineer, IPT Lead, or people manager)
- Demonstrated ability to lead, mentor, and motivate engineers while fostering collaborative and inclusive work environment
- Experience designing PCBA-level and system-level electronics packaging and mechanical systems for aerospace, defense, or communications applications
- Experience with complete product development lifecycle: concept development, design, analysis, manufacturing, integration, environmental qualification, production, and sustainment
- Proficiency with professional simulation tools (ANSYS Mechanical, SolidWorks Simulation) and CAD/PDM systems (SolidWorks, SolidWorks PDM)
- Experience designing for aerospace and defense manufacturing methods: CNC machining, sheet metal fabrication, castings, bonded assemblies, additive manufacturing, electromechanical assemblies
- Experience supporting environmental qualification testing (MIL-STD-810, RTCA DO-160, and other aerospace/defense standards)
- Working knowledge of industry standards: IPC, ASME, SAE, MIL-STD, RTCA DO-160, and related aerospace/defense specifications
- Excellent written, verbal, and presentation communication skills
- Ability to prioritize competing demands while supporting multiple concurrent programs
**PREFERRED QUALIFICATIONS:**
- Master's degree in Mechanical Engineering or related discipline
- Experience with phased array antenna systems, RF electronics packaging, avionics, tactical communication systems, or defense electronics
- Experience supporting EMI/EMC, vibration, shock, temperature, humidity, ingress protection, and other environmental qualification campaigns
**NOTE:** Applicant must be a U.S. citizen, lawful permanent resident, conditional resident, asylee, or refugee, or eligible to obtain required authorizations from the U.S. Department of State to comply with U.S. Government Space Technology Export Regulations.
