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Vinci4D.ai is building Physics AI for hardware design—a software platform that helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems using cutting-edge AI. The platform bridges the gap between the accuracy of traditional simulation and the speed of AI, redefining how advanced semiconductors are designed, verified, and brought to market.
In this hybrid technical sales role based in Palo Alto (3 days/week in office), you will accelerate adoption of Vinci's software with leading engineering teams. You will work closely with prospective customers to demonstrate the platform's capabilities and show how it improves product design, thermal performance, time to market, and reliability.
Key responsibilities include:
- Engage with customer engineering teams during evaluation by supporting simulation setup, running test cases, and interpreting results to demonstrate value
- Collaborate with the sales team to deliver product demonstrations, conduct proof-of-concept evaluations, and participate in technical discussions with prospects
- Support customer onboarding and deployments with technical guidance, training, and troubleshooting
- Identify customer pain points and workflow challenges; collaborate with product and engineering teams to improve capabilities
- Deliver technical training sessions and workshops to enable customer adoption and scaling
- Represent Vinci at industry conferences and semiconductor events with live demonstrations and technical engagement
- Maintain understanding of competitive technologies, industry trends, and market positioning
You will build and simulate thermo-mechanical models based on customer designs to validate Vinci's software. You will apply expertise in mechanical and thermo-mechanical analysis to evaluate warpage, stress behavior, and reliability in electronics packages, chips, and wafer-scale devices. A strong foundation in continuum mechanics is essential to analyze complex physical phenomena including linear and nonlinear behavior, geometric and material nonlinearities, and contact interactions.
The role includes moderate travel, primarily within the United States, with some infrequent international travel for key customers and events in Asia and Europe.
**Requirements:**
- Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field
- 3+ years of hands-on mechanical analysis for warpage, stress, and reliability using commercial software (Ansys, Abaqus, LS-Dyna, etc.)
- Experience in customer-facing roles
- Strong problem-solving mindset and ability to quickly learn new tools and workflows
- Strong ability to communicate complex results clearly to mixed audiences (technical and business)
**Preferred Qualifications:**
- Familiarity with semiconductor electronics packaging, advanced packaging, or foundry (chip warpage, wafer warpage, 2.5D/3D IC, etc.)
- Experience in pre-sales, technical sales, or customer-facing engineering roles
- Ability to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools
- Experience commercializing technical software—ideally EDA or simulation tools—into semiconductor and electronics companies
