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IonQ is seeking a Staff Process Engineer, Packaging to lead hands-on manufacturing and process engineering for quantum processing unit (QPU) production at their College Park, Maryland headquarters. This is a floor-first engineering role where you will spend 70–80% of your time in the cleanroom operating, programming, troubleshooting, and improving complex packaging equipment—particularly wire bonding and die/flip-chip bonding systems.
You will provide real-time sustaining engineering support to keep QPU builds, technician work, and critical equipment on track. Key responsibilities include personally operating and troubleshooting packaging equipment, creating and validating equipment recipes and process programs using data-driven experimentation, investigating equipment faults and process excursions to identify root causes and implement corrective actions, and training operators on packaging equipment and processes. You will also improve existing packaging processes with respect to yield, throughput, repeatability, uptime, and capability, and support hands-on prototype and new-product builds from component preparation through assembly, inspection, characterization, and release.
This role requires careful handling of fragile, high-value components and excellent cleanroom discipline. While specific microelectronics packaging experience is valuable, the company is looking for an experienced engineer driven to learn, who takes pride in careful hands-on work, and who is committed to delivering hardware. The role may be leveled as Process Engineer or Senior Process Engineer based on demonstrated experience and scope; this posting targets the Staff / Principal level based on the scope of equipment ownership and process leadership described. Travel is minimal (less than 10%).
