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Lightmatter is revolutionizing AI data center infrastructure through photonics technology. The company recently raised $400M in Series D funding at a $4.4B valuation and is scaling rapidly across all departments.
In this Staff-level role, you will serve as the technical authority for thermo-mechanical simulation within the packaging organization. You will set standards for model fidelity, validation methodology, and documentation practices across the team. Your responsibilities include developing finite element stress, warpage, and assembly process models for wafer-level and unit-level photonic packaging; performing multi-physics simulations including solder collapse and thermal-structural analysis; and identifying design, process, and material parameters to mitigate failure modes and optimize yield.
You will identify capability gaps in simulation tooling and champion fundamental investigations to strengthen the team's technical foundation. Key deliverables include analytical and semi-empirical models for quick-turn assessments, Python and MATLAB automation frameworks to scale simulation throughput, and characterization/validation programs through internal prototyping and vendor collaboration. You will drive reliability analysis under product use conditions and communicate findings with authority to cross-functional stakeholders including design, process, and product engineering teams.
Required: MS or PhD in Mechanical Engineering, Material Science, or related field; deep expertise in FEA tools (Ansys, Abaqus); hands-on multi-physics simulation experience; strong understanding of semiconductor packaging failure modes (solder fatigue, delamination, CTE mismatch, underfill cracking); experience with wafer-level and unit-level assembly processes (flip-chip, BGA, 3D packaging); proficiency in Python and/or MATLAB; ability to develop analytical models; and experience driving characterization programs.
Preferred: Track record communicating complex technical findings to cross-functional teams; strong technical writing skills; experience with photonic packaging technologies (silicon photonics, co-packaged optics, fiber attach, heterogeneous integration).
