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Salary: CAD 160,000 - 200,000 / annual
Xanadu is building quantum computers designed to be useful and accessible globally. This Senior Packaging NPI Engineer role is pivotal to introducing new packaging processes and technologies from concept through mass production, supporting the company's mission to develop quantum computing solutions for the world's most challenging problems.
You will lead the successful introduction of new packaging processes and technologies, collaborating across R&D, design, manufacturing, and supply chain teams throughout the entire product lifecycle. The role emphasizes hands-on work with equipment and processes to ensure robust, scalable, and ultra-low-loss packaging solutions critical to quantum computing applications.
Key responsibilities include:
- Leading development, validation, and implementation of new packaging processes and equipment from concept through pilot production to high-volume manufacturing
- Conducting comprehensive process characterization, optimization, and validation for new packaging lines and equipment
- Researching, evaluating, selecting, and qualifying new packaging equipment and materials while staying current with industry advancements
- Acting as a subject matter expert in troubleshooting complex packaging process issues during NPI phases and providing ongoing production support
- Managing multiple concurrent NPI projects, ensuring timely delivery and adherence to technical specifications
- Working directly with machines and equipment as needed throughout the NPI process
This is a new position offering the opportunity to shape packaging strategy for an emerging quantum computing company at a critical growth stage.
Requirements:
- Master's degree in Mechanical Engineering, Electrical and Electronic Engineering, Photonics Engineering, Packaging Engineering, Materials Science, or related technical field
- Minimum 5+ years of progressive experience in packaging engineering with strong emphasis on new product introduction (NPI) in a manufacturing environment
- Basic understanding of photonic-based on-chip and off-chip systems
- Proven experience with various packaging technologies and equipment
- Excellent analytical and problem-solving skills with data-driven decision-making approach
- Demonstrated ability to manage complex technical projects from conception to completion
- Exceptional communication, presentation, and interpersonal skills for cross-functional collaboration
- Proficiency with CAD software (e.g., SolidWorks, AutoCAD) and statistical analysis tools
Preferred qualifications:
- Strong understanding of photonic-based on-chip and off-chip systems
- Proven experience with advanced die-to-carrier, die-to-die, and die-to-wafer bonding techniques
- Experience with automation and robotics in packaging
- Familiarity with relevant industry standards and regulations
- Experience with FiconTEC equipment highly desired
