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Diamond Foundry is addressing thermal limitations in AI & cloud compute, electric-vehicle power electronics, and 5G/6G wireless by producing single-crystal diamond wafers for semiconductor thermal management. The company has achieved unicorn status, raised $515M in funding, and is executing a multi-billion-dollar expansion plan using zero-emission energy to convert greenhouse gas into diamond wafers.
You will lead the development of advanced liquid cooling solutions for thermal management of state-of-the-art semiconductor processing devices, leveraging single-crystal diamond for high-performance heat spreading. This is a hands-on role spanning early-stage concept development through prototype fabrication, testing, and integration with diamond-based semiconductor systems.
Key responsibilities include:
- Lead design and development of high-performance liquid cooling architectures for diamond-based semiconductor thermal management, including jet impingement, spray, and microjet-based concepts
- Model and optimize fluid flow and heat transfer to define jet/nozzle geometries, flow distribution, pressure, temperature, and operating conditions across single- and two-phase heat transfer regimes
- Design cooling hardware for prototyping and manufacturing, incorporating fluid distribution, extraction/return paths, and micro-machined features while respecting fabrication constraints
- Build and experimentally characterize prototypes, analyzing thermal and fluid performance and iterating designs based on test results
- Drive technical development from initial concept through prototype demonstration and integration with diamond-based semiconductor devices, collaborating with internal teams and external research or fabrication partners
Requirements:
- Degree in Mechanical Engineering, Thermal Engineering, Fluid Mechanics, or related field; MSc or PhD highly valued, especially combined with applied R&D and prototype development experience
- Strong background in thermal engineering, fluid dynamics, and heat transfer with experience developing high-performance liquid cooling systems or devices; Ansys or COMSOL experience is a plus
- Hands-on experience designing and validating thermal-fluid hardware with exposure to jet impingement, spray cooling, microjets/microfluidics, or other high heat-flux cooling approaches
- Experience with computational and/or analytical thermal-fluid modeling, ideally including CFD, combined with experimental testing and validation
- Experience designing components for precision or micro-scale manufacturing processes such as micromachining, and translating engineering concepts into manufacturable prototypes
