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Salary: USD 149,659 - 224,437 / annual
Echodyne is seeking a Principal PCB/A Materials & Process Engineer to serve as a technical authority and subject matter expert for printed circuit board materials, fabrication processes, and electronics assembly. The company develops compact solid-state beam-steering radar systems for autonomous vehicles, uncrewed aircraft, drones, and critical infrastructure security applications.
In this role, you will be responsible for ensuring that PCB and PCBA designs deliver RF, high-speed digital, thermal, mechanical, and manufacturing performance within producible designs. You will work primarily in new product development, partnering with design engineering, program management, operations, supply chain, and suppliers to align product requirements with capable, scalable, and reliable manufacturing processes.
Key responsibilities include:
- Serve as the technical authority for PCB materials, stackups, fabrication processes, and manufacturability tradeoffs for complex RF, high-speed, and mixed-signal designs
- Partner with cross-functional teams during new product introduction (NPI) to align product requirements with practical PCB and PCBA manufacturing capabilities
- Lead technical engagement with PCB fabricators, material suppliers, and electronics manufacturing suppliers to assess advanced materials, new capabilities, identify process gaps, and support supplier development
- Support supplier selection, qualification builds, production readiness, yield improvement, and root-cause analysis related to PCB fabrication and PCBA manufacturing before production release
- Provide practical design and process guidance to improve manufacturability, reliability, cost, and supplier execution
- Support production supplier development where new or improved capabilities are required for released products, cost reduction, yield improvement, reliability, or manufacturability
Requirements:
- Knowledge of PCB materials, fabrication processes, stackups, and design-for-manufacturing/quality/reliability practices for RF, high-speed, or mixed-signal products
- Experience working directly with PCB fabricators, material suppliers, and electronics manufacturing suppliers
- Ability to evaluate PCB/PCBA designs, fabrication documentation, supplier design rules, and manufacturing tradeoffs
- Experience with RF PCB materials, PTFE or mixed-material stackups, rigid-flex construction, metal-backed boards, or complex multilayer fabrication
- Experience with advanced PCB processes such as sequential lamination, blind/buried vias, filled vias, controlled-depth drilling, or controlled-impedance structures
- 10 or more years' experience in design and manufacture of circuit boards for RF applications
- Ability to travel up to 25% domestically and internationally
- U.S. citizenship, green card holder status, or asylum/refugee status in the U.S. (due to export control requirements)
