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Lumilens is building photonics infrastructure for AI supercomputing, developing chip-to-chip optical interconnects and scalable photonic engines. The company is Series B funded and led by industry veterans.
You will lead the full New Product Introduction (NPI) lifecycle for silicon photonics wafer-level test solutions for Near-Package Optics (NPO) and Co-Packaged Optics (CPO) products, from initial development through high-volume production. This is an end-to-end ownership role spanning architecture, validation, manufacturing transfer, and ongoing support.
Key responsibilities include:
- Architecting and developing wafer-level test systems and testers for photonic integrated circuits (PICs) and their integration with switch/ASIC dies
- Leading the tester RFQ process and developing test hardware (wafer probers, optical probe/alignment fixtures, edge/grating coupler interfaces, RF probe cards) and software (automated test sequences, data acquisition, high-speed BERT/PAM4 integration)
- Managing the transfer of wafer-level test platforms from NPI to mass production, ensuring repeatability, throughput, optical alignment stability, and reliability targets at volume
- Developing test process flows, work instructions, and training materials for production operators and technicians
- Partnering with manufacturing, quality, and equipment vendors to qualify testers and optical probers on the production floor
- Providing ongoing engineering support to resolve test-related yield, throughput, and equipment issues in production
Required qualifications: Bachelor's degree or higher in Electrical Engineering, Optical Engineering, Photonics, Physics, or related field. 5+ years of semiconductor or silicon photonics test engineering experience with hands-on wafer-level test development. Proven track record of taking a test platform from NPI through production transfer at volume. Experience with wafer-level optical probing/alignment systems (active alignment, fiber array probing) and automated test equipment (ATE). Familiarity with high-speed electrical test (SerDes, PAM4/NRZ, BERT) relevant to co-packaged optics. Knowledge of electro-optical measurement instruments (optical power meters, tunable lasers, source meters, network/spectrum analyzers, BERT). Working knowledge of DOE, SPC, Gauge R&R, and yield/binning analysis. Understanding of silicon photonics PIC characterization and CPO/NPO packaging architecture is a plus.
