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nEye Systems is seeking a Senior Packaging Failure Analysis Engineer to lead structured failure analysis and root-cause investigations across silicon photonics, MEMS, optical packaging, bonded assemblies, and PCBAs.
You will perform and interpret cross-sections of bonded structures and material interfaces, identifying defects including intermetallic formation, diffusion, cracking, voiding, contamination, and delamination. You'll develop comprehensive failure analysis workflows using non-destructive and destructive analytical techniques such as optical microscopy, X-ray/CT, SAM, IR imaging, cross-sectioning, FIB, SEM/EDS, XPS, and XRD.
Key responsibilities include:
- Applying deep materials science knowledge—phase diagrams, interfacial reactions, and failure mechanisms—to interpret analytical results (e.g., phase formation in Au-Si bonded interfaces)
- Analyzing fusion and eutectic bonded interfaces (Si-Si, Si-glass, Au-Sn, Au-Si systems) for unbonded regions, particle-induced voids, cracking, and interfacial defects
- Investigating photonics fiber/FAU attach and adhesive failures, including coupling-loss shifts, alignment drift, delamination, voiding, and cure shrinkage
- Supporting epoxy/material selection and characterization (CTE, modulus, Tg, refractive index, ionic content, cure kinetics) using DSC and FTIR
- Investigating solder and PCBA failures (voiding, non-wet opens, head-in-pillow, pad cratering, IMC growth, fatigue cracking, warpage)
- Supporting hermeticity and MEMS failure investigations (leak testing, moisture ingress, contamination, stiction, cavity pressure shifts)
- Performing or coordinating mechanical characterization (die shear, fiber pull, bond-strength/toughness testing, chisel testing, four-point bending)
- Maintaining disciplined FA documentation, driving 8D/root-cause and corrective-action closure, and communicating findings to engineering and manufacturing teams
- Feeding FA learnings into DFM/DFR, design improvements, process development, and OSAT/module partner corrective actions
- Supporting product qualification and reliability investigations against JEDEC, Telcordia GR-468, and MIL-STD-883 requirements
- Helping define and establish in-house FA laboratory capabilities, including equipment selection, sample-preparation workflows, and best practices
REQUIREMENTS:
- BS, MS, or PhD in Materials Science, Materials Engineering, Physics, Mechanical Engineering, Chemical Engineering, or related discipline
- 8+ years of hands-on experience in failure analysis, materials characterization, or physical analysis within semiconductors, advanced packaging, photonics, MEMS, microelectronics, or related field
- Demonstrated expertise in cross-sectioning and analysis of bonded interfaces
- Strong knowledge of materials behavior, phase diagrams, intermetallics, interfaces, adhesion, fracture, and material interactions
- Hands-on experience with several analytical techniques: SEM/EDS, FIB, XPS, XRD, optical microscopy, X-ray/CT, SAM, FTIR, DSC
- Ability to select appropriate analytical techniques based on failure mechanism and understand strengths/limitations of each method
- Experience investigating packaging or assembly failure mechanisms involving adhesives, solder joints, wafer/die bonding, eutectic bonding, optical attach, or hermetic packages
- Strong root-cause problem-solving skills with hypothesis-driven, structured approach to failure analysis
- Ability to translate complex analytical findings into clear conclusions and actionable engineering recommendations
PREFERRED:
- Experience establishing, expanding, or operating an internal failure-analysis laboratory
- Experience with silicon photonics, MEMS, optical packaging, or advanced semiconductor packaging
