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Boston Materials develops advanced thermal interface materials (TIM) using proprietary Z-axis Carbon Fiber technology to address thermal management challenges in AI, HPC, and semiconductor applications. The company's Liquid Metal ZRT product targets next-generation silicon packaging and data center infrastructure.
As Senior Applications Engineer, you will be the primary technical partner for customers evaluating and adopting Boston Materials' high-performance TIM products. You will lead early- to mid-stage customer engagements with hyperscalers, ODMs, and OSATs, translating their thermal management requirements into actionable technical specifications and validation plans.
Key responsibilities include:
- Conducting technical assessments of customer thermal challenges and packaging architectures
- Providing product samples, performance data, and integration guidance to support customer qualification efforts
- Leading design-in activities and troubleshooting thermal interface integration issues
- Capturing customer requirements and feeding insights back to product and R&D teams
- Ensuring successful adoption of TIM solutions in advanced semiconductor packaging applications
- Supporting customers through qualification, testing, and production ramp phases
You will work at the intersection of customer engagement, technical problem-solving, and product performance validation. The role offers direct visibility into how your work impacts customer success and company growth, with minimal organizational layers. You'll collaborate with leading materials science and semiconductor engineering experts, taking ownership of projects that directly influence the adoption of cutting-edge thermal solutions in AI and data center systems.
Ideal candidates have deep experience in thermal management, semiconductor packaging, or materials integration, combined with strong customer-facing and technical communication skills.
