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nEye Systems is a well-funded optical switch startup developing MEMS-based silicon photonics optical circuit switches (OCS) designed to revolutionize data center architecture. The company's technology eliminates critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units, offering hyperscale data centers enhanced performance, efficiency, and scalability with ultra-low power consumption.
As Principal Wafer Bonding Integration Engineer, you will lead the development, integration, and manufacturing transfer of advanced wafer bonding processes that are foundational to nEye's next-generation optical switching products. This is a highly cross-functional role sitting at the intersection of product engineering, process integration, and manufacturing.
Key responsibilities include:
- Developing robust wafer bonding solutions for advanced optical switching chips
- Partnering closely with internal design teams to ensure manufacturability and performance
- Collaborating with external foundry partners on process development and optimization
- Driving new product introduction (NPI) initiatives from concept through volume manufacturing
- Enabling successful transition of processes into high-volume manufacturing
- Solving complex manufacturing challenges at the wafer bonding interface
- Establishing process specifications, yield targets, and quality metrics
The ideal candidate combines deep technical expertise in wafer bonding with strong product integration experience and enjoys working directly with foundries. Relevant background includes foundry process integration, advanced packaging, MEMS, silicon photonics, or Technical Service Engineering experience. You should be comfortable navigating the intersection of design requirements, process capabilities, and manufacturing constraints.
