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Graphcore, a globally recognized leader in AI computing systems and member of the SoftBank Group, is opening a new AI Engineering Campus in Austin. This Principal Thermal Engineer role is a senior technical position within a project team delivering complex AI data center hardware.
You will own the overall thermal solution for advanced semiconductor and data center hardware, including creation of specifications, design review, qualification, testing, and validation. Your primary responsibility is ensuring product functionality and meeting all applicable technical thermal specifications.
Key responsibilities include:
- Designing, developing, and evaluating liquid cooling solutions with focus on direct liquid cooling (DLC) technology
- Leading system-level thermal design and cold plate cooling heatsink technology
- Performing thermal simulations and analyses using industry-standard software (FlowTherm, ANSYS, COMSOL)
- Developing and executing comprehensive test plans to validate thermal solutions
- Guiding and directing ODM vendors on thermal design, implementation, and testing
- Working with third-party vendors and suppliers to ensure product features are achieved
- Collaborating with system architects, chip and board designers, and software/firmware engineers
- Managing product thermal specifications, development schedules, and cost/quality goals
Required qualifications:
- Bachelor's, Master's, or Ph.D. in Mechanical Engineering
- Minimum 5 years of server thermal design experience
- Deep expertise in thermal fluid dynamics, heat transfer, and system-level thermal design
- Experience with direct liquid cooling and cold plate technology
- Understanding of microprocessor architecture and thermal profiles
- Strong thermal simulation and analysis capabilities
- Experience with system-level thermal and fan control algorithms
- Excellent problem-solving, root-cause analysis, and communication skills
- Ability to work independently and collaboratively with cross-functional teams
