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Salary: USD 217,000 - 308,000 / annual
Lightmatter is a venture-backed AI infrastructure company that invented the world's first 3D-stacked photonics engine (Passage™) for connecting thousands to millions of processors at light speed in extreme-scale data centers. The company recently raised $400M in Series D at a $4.4B valuation.
You will provide technical leadership to the Hardware Systems organization, responsible for delivering board and system solutions using Lightmatter's silicon photonics technology for state-of-the-art AI accelerators and massive scale-out interconnect platforms.
Key responsibilities include:
- Technical leadership and mentorship of team members to drive excellence
- Own and drive multiple complex hardware systems projects from concept through production
- Collaborate with system architects to define hardware systems for photonic AI infrastructure
- Define, develop, and review PCBAs to meet electrical, power, and interface requirements
- Lead hands-on integration, verification, and validation across bench bring-up, EVT/DVT, and production release
- Drive cross-functional collaboration with firmware, photonics, packaging, and software teams
- Maintain comprehensive hardware documentation including schematics, design reviews, test plans, and validation reports
- Research components and technologies to meet product goals and contribute to technology roadmap
- Mentor and provide technical guidance to engineers
Required qualifications:
- Bachelor's degree in Electrical Engineering or related discipline with 15+ years of relevant industry experience
- Demonstrated track record of taking multiple complex hardware systems from concept through production
- Deep knowledge of VRMs, high-speed SerDes, and interfaces/protocols (PCIe, Ethernet, SPI/QSPI, I3C, I2C, JTAG)
- Experience leading multi-disciplinary development, integration, and troubleshooting across electrical, mechanical, and firmware domains
- Strong ownership mindset and ability to work in ambiguous, dynamic environments
Preferred qualifications include experience with AI/HPC data center infrastructure, optical transceivers, or silicon photonics products; Systems Engineering methodology; and advanced packaging technologies.
