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Salary: USD 215,000 - 265,000 / annual
DensityAI is seeking a PCB Quality Engineer to own the technology roadmap, manufacturability, and quality of advanced PCBs and package substrates for AI accelerator silicon. This is a hands-on technical leadership role where you'll drive substrate and PCB technology strategy—including embedded passives/actives, inorganic core substrates, and novel thermal solutions—while ensuring complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to specification.
Key responsibilities include:
• Develop and execute the advanced substrate and PCB technology roadmap aligned to AI accelerator product needs, with focus on embedded passive/active integration and inorganic core substrates
• Develop and qualify new materials, structures, and processes with substrate and PCB vendors, shepherding them from evaluation through production readiness
• Partner cross-functionally with packaging, SI/PI, thermal, mechanical, and systems teams to improve and enable new product architectures, including passive/active embedding, novel thermal solutions, and improved signal/power integrity and mechanical behavior
• Lead DFM/DFx (Design for Manufacturability/X) reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF), identifying manufacturability, yield, and reliability risks before tape-out
• Own substrate and PCB supplier quality: qualify suppliers, drive PPAP (Production Part Approval Process) and first-article inspections, ensure process capability, and hold partners to specification through NPI and volume ramp
• Define quality standards and acceptance criteria (IPC and internal) that gate production builds; drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier
• Support reliability qualification testing (thermal cycling, HAST, etc.) and apply statistical methods (SPC/DOE) to monitor and improve process quality across suppliers
• Build DFM guidelines, checklists, and quality processes that scale from prototype through production
Requirements:
• BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics
• Hands-on experience developing and qualifying advanced substrate/PCB technologies—embedded passives/actives, inorganic and organic core substrates, ABF build-up, flip-chip BGA—including materials, structures, and process development with vendors
• Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and failure modes
• Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions
• Supplier quality depth: qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners
• Fluency in IPC standards (e.g., IPC-6012, IPC-A-600, or substrate equivalents) and quality acceptance criteria
• Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects
