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Salary: CAD 110,000 - 140,000 / annual
Xanadu is building quantum computers designed to be useful and accessible globally. The company is pursuing an ambitious mission to develop technologies that solve some of the world's most challenging problems through quantum computing.
As a Packaging Engineer on the Hardware team in Toronto, you will work within the Packaging group supporting the development of Xanadu's rack-scale quantum computer. You will operate, optimize, and improve high-precision die bonding processes and equipment under the guidance of senior engineers. Your day-to-day responsibilities include executing sample build assignments, performing laboratory maintenance, and contributing to the assembly of photonic and micro-electronic components for leading-edge quantum hardware.
This is a hands-on role requiring expertise in advanced device integration and sample preparation. You will work with precision equipment and sensitive materials, troubleshooting defects and ensuring quality across die bonding operations. The role offers the opportunity to contribute directly to hardware development at a company tackling one of technology's most ambitious challenges.
REQUIREMENTS:
Basic qualifications:
- BSc or higher in Engineering, Science, or related field
- 2+ years experience in laboratory or cleanroom environment
- Basic understanding of semiconductor packaging processes
- Experience with epoxy and flip-chip (F/C) die bonding
- Basic knowledge of microscope techniques
- Self-motivated, able to work independently and collaboratively
- Detail-oriented with positive attitude
- Technical writing skills
Preferred qualifications:
- Experience with Mass Reflow (MR), Thermo-Compression Bonding (TCB), and Laser-Assisted Bonding (LAB)
- Experience handling and processing diverse bump materials (Au, SAC305, SnBi, lead-free solders)
- Experience with wafers and sensitive optoelectronic assemblies
- Ability to identify and troubleshoot key defects
- Experience with Die Shear Testing and basic electrical testing
