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Salary: USD 218,000 - 317,000 / annual
Lightmatter is a venture-backed leader in AI data center infrastructure, having raised $400M in Series D at a $4.4B valuation. The company invented Passage™, a 3D-stacked photonics engine that connects thousands to millions of processors at light speed for extreme-scale AI and HPC workloads.
As Packaging Architect, you will own the end-to-end development of advanced packaging solutions from concept through production release. You'll serve as a key technical decision-maker, translating complex requirements from product architects, chip designers, and system architects into precise packaging specifications that balance performance, cost, and manufacturability.
Key responsibilities include:
- Evaluate and execute trade-offs across EIC/PIC layouts, die-to-die interfaces, fiber attachment methods, and packaging technologies, analyzing impact on performance, power efficiency, cost, manufacturability, and form factor
- Define and own packaging specifications spanning electrical, thermal, and mechanical performance
- Determine optimal package architecture through rigorous analysis of competing design constraints across silicon, package, and system levels
- Partner with supply chain engineering to define technology and material requirements for substrate fabrication, assembly, and vendors
- Collaborate with Quality & Reliability teams on packaging requirements, qualification criteria, and issue resolution
- Engage with product teams and customers in data center and HPC segments to anticipate emerging packaging architectures and influence roadmap
- Monitor competitive landscape in packaging technologies to inform strategic and technical decisions
Required: Ph.D. or Master's in Electrical Engineering, Mechanical Engineering, Materials Science, or related field. 15+ years in advanced (2D/3D) packaging technologies with optical packaging exposure. 10+ years deep expertise in power/signal integrity, thermal-mechanical analysis, or optical packaging. Demonstrated ability to perform system-level trade-offs across silicon, package, and board. Extensive experience with high-speed interfaces (SERDES, PCIe, D2D interconnects). Proven track record delivering packages and products from concept through production. Proficiency with industry-standard EDA and CAD tools.
Preferred: Strong communication and collaboration skills across engineering, supply chain, and external suppliers. Technical leadership experience managing complex, multi-disciplinary projects. Ability to operate independently and manage ambiguity. Creative problem-solver with track record under pressure.
