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Dominion Dynamics is seeking a Mechanical Engineer specializing in thermal design to develop thermal management solutions for mission-critical electronics operating in harsh, remote, and extreme environments. The role focuses on converting system requirements into reliable, scalable thermal architectures that keep sensitive electronics within operational limits across extreme temperature swings, often with limited or no forced airflow.
You will drive thermal design, analysis, and validation from early concept through simulation, prototyping, testing, and production ramp with suppliers. Key responsibilities include:
- Design and develop thermal management solutions including heat sinks, heat spreaders, thermal interface materials, and conduction paths for sealed, rugged electronics in harsh environments.
- Perform thermal analysis, simulation (CFD), and hand calculations to predict component temperatures, identify hot spots, and ensure reliable performance across extreme temperature conditions.
- Collaborate with electrical and systems engineers on power dissipation budgets, component placement, and material selection to optimize system-level thermal performance.
- Plan and execute thermal testing and validation, correlate models to test data, and drive design revisions based on test and field feedback.
- Develop CAD models in SolidWorks with engineering calculations and design documentation compliant with engineering standards.
- Work with mechanical, manufacturing, and supply chain teams to ensure thermal solutions meet cost, weight, size, and production constraints using DFM and DFA principles.
- Contribute to continuous improvement of thermal design standards, test procedures, and product documentation.
The company is building defence capability for the Canadian Armed Forces and allies, with systems already fielded. You'll work in a high-trust environment with short feedback loops, rapid iteration, and direct access to leadership.
REQUIREMENTS:
- Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
- 4–7 years of experience in thermal design and analysis for electronic systems, ideally rugged, sealed, or harsh-environment hardware.
- Proficiency in SolidWorks.
- Experience with thermal simulation and CFD tools (ANSYS Icepak or Fluent, Simcenter FloTHERM, SolidWorks Flow Simulation, or similar).
- Strong understanding of heat transfer fundamentals (conduction, convection, radiation) and thermal management techniques for electronics (heat sinks, heat spreaders, heat pipes, thermal interface materials, conduction paths).
- Knowledge of materials and manufacturing processes relevant to thermal hardware (machining, extrusion, die casting).
- Experience with thermal test methods and instrumentation (thermocouples, IR thermography, environmental chambers) and correlating test results to models.
- Familiarity with environmental test standards for rugged electronics (e.g., MIL-STD-810).
- Ability to produce clear technical documentation and engineering drawings.
- Experience designing thermal hardware for sub-zero environments.
- Ability to design passive cooling and heating solutions that minimize power draw.
No defence background required. The company welcomes applications from candidates who don't tick every box.
