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CesiumAstro develops cutting-edge communication systems for satellites, UAVs, launch vehicles, and other space and airborne platforms. The Skylark product line focuses on rapid design, build, and test of active phased array antennas (AESA) for terrestrial and airborne applications, spanning high-power ground terminals for missile defense to commercial airline and helicopter connectivity solutions.
As a Mechanical Engineer II, you will own mechanical designs of CesiumAstro products through all phases of the development process, from initial concept through in-orbit support. You will work in a dynamic, cross-functional startup environment with hands-on, interactive responsibilities.
Key responsibilities include:
- Design and develop mechanical components, assemblies, structures, mechanisms, and hardware supporting products and manufacturing
- Perform engineering analyses, calculations, tolerance studies, structural evaluations, and design trade studies
- Review engineering drawings, CAD models, specifications, and technical documentation
- Conduct mechanical testing, verification, qualification, and validation activities
- Analyze engineering data, test results, and manufacturing information to identify trends and recommend solutions
- Support root cause investigations, engineering changes, corrective actions, and design improvements
- Collaborate with engineering, manufacturing, quality, supply chain, and operations teams
- Develop engineering drawings, 3D models, technical reports, design documentation, and bills of materials
- Participate in design reviews, engineering investigations, and manufacturing reviews
- Maintain engineering documentation and configuration-controlled technical data
- Apply mechanical engineering methodologies, standards, and customer requirements throughout product development
- Present engineering design review materials to customers and leadership
- Recommend improvements to enhance product performance, manufacturability, reliability, and quality
You will need proficiency in electronics packaging design, mechanical simulations and analyses, CAD, spacecraft mechanical interfaces, and environmental qualification of electronic assemblies. Thermal management design, precision machining principles, thermal and shock/vibration simulation, EMI/EMC mitigation, GD&T, FEA, and cost analysis are essential to success in this role. Excellent written and verbal communication skills are required.
REQUIREMENTS:
- Bachelor of Science (BS) or Master of Science (MS) degree in Mechanical or Aerospace Engineering from an accredited university
- Minimum 2 years of industry experience in design and analysis of electronics packaging (thermal, vibration, stress dynamics) OR spacecraft structures and mechanisms
- Familiarity with electronics assemblies and experience working closely with electrical engineers
- Experience with professional mechanical and FEA CAD tools (e.g., Solidworks Simulation)
- Experience with CNC manufacturing
- Experience with EMI/EMC mitigation techniques
- Excellent written and verbal communication skills
- Must be a U.S. citizen, lawful permanent resident, conditional resident, asylee, or refugee, or eligible to obtain required authorizations from the U.S. Department of State (export control requirement)
