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Salary: USD 150,000 - 225,000 / annual
Cowboy Space Corp. is building space-based infrastructure to power and connect the orbital economy. Founded in 2024 by Baiju Bhatt (Robinhood co-founder) and backed by leading investors, the company develops satellites in Low Earth Orbit that collect sunlight and enable new capabilities—from powering on-orbit compute to transmitting energy via infrared lasers and delivering secure, high-bandwidth optical data.
The Payload Mechanical team seeks a Lead Mechanical Engineer to own the structural and thermal-mechanical design of space-based compute hardware. This is a hands-on leadership role requiring deep expertise in high-reliability space systems, from packaging architecture and thermal trade studies to hardware integration and qualification.
Key responsibilities include: owning the mechanical architecture of compute hardware (chassis, PCB retention, connectors, thermal management) from concept through production; performing system-level trade studies on packaging, mass, and thermal performance; leading and mentoring a team of mechanical engineers; defining interfaces and technical budgets for compute and power electronics; driving structural and thermal analysis efforts; developing mechanical drawings, GD&T specifications, and ICDs; defining and executing mechanical integration and test plans including environmental qualification (vibration, shock, thermal-vacuum); representing the mechanical team in design reviews; and collaborating cross-functionally with electrical, thermal, and spacecraft teams.
Required qualifications: Bachelor's in Mechanical or Aerospace Engineering; 5+ years in mechanical engineering for flight hardware in aerospace, defense, or high-reliability electronics; demonstrated experience as technical lead on mechanical design of electronics enclosures or compute hardware for space or high-reliability applications; proficiency in 3D CAD (NX, Solidworks, or equivalent) and GD&T; experience with structural analysis and thermal modeling tools; experience taking flight hardware through environmental qualification; strong understanding of thermal management for high-power electronics in vacuum; experience managing direct reports or leading technical teams.
Preferred: Master's degree; 8+ years developing flight hardware for space or defense; experience with conduction-cooled electronics packaging, cold plate design, or liquid cooling solutions; familiarity with high-power compute or GPU hardware packaging; experience with radiation design for LEO electronics; hands-on flight hardware integration and test experience; prior technical lead or engineering manager experience on flight programs.
