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Lumilens is building photonics infrastructure for AI supercomputing. We seek a Die Attach Manufacturing Engineer to lead process development, qualification, and optimization for Photonic Integrated Circuits (PICs) and silicon photonics packaging.
You will own die attach processes achieving sub-micron placement accuracy and optical-grade quality through active/passive alignment, epoxy/adhesive dispense, eutectic/AuSn solder attach, and flip-chip bonding. Responsibilities span process engineering, equipment ownership, and cross-functional collaboration.
PROCESS ENGINEERING: Develop and characterize die attach processes for PIC/silicon photonics dies, laser dies, and hybrid assemblies. Establish process specifications, control plans, and process windows using DOE methodology for sub-micron accuracy. Lead root cause analysis and CAPA for yield loss and photonics-specific defects (optical misalignment, coupling loss, epoxy outgassing, die tilt, voids). Support NPI for new photonic packages and transceiver modules. Monitor SPC/Cpk data on placement accuracy, bond-line thickness, and optical coupling efficiency. Evaluate and qualify optically-compatible die attach materials with Materials and Optical Design teams. Partner with Quality and Reliability on failure analysis and testing (thermal cycling, humidity, optical power, hermeticity, shear/pull testing, X-ray/CSAM inspection). Support active alignment process development with real-time optical feedback.
EQUIPMENT ENGINEERING: Own performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations). Lead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding tools including vision systems and sub-micron motion stages. Maintain preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime. Work with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente) for tool upgrades, retrofits, and technical escalations. Drive automation, tooling, and fixture improvements for throughput while maintaining alignment tolerances and protecting optical facets. Support equipment capacity planning and CAPEX proposals.
CROSS-FUNCTIONAL COLLABORATION: Collaborate with Design, Product, Quality, and Operations teams. Provide technical training to manufacturing technicians and operators. Support process/equipment documentation for audits. Track and report KPIs: yield, Cpk, equipment uptime, scrap rate, cycle time. Engage in cost reduction, lean manufacturing, and Six Sigma initiatives.
REQUIRED: Bachelor's degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering or related field (Master's preferred). 3–7 years hands-on experience in silicon photonics/PIC industry focusing on die attach process/equipment engineering for optical or opto-electronic packaging. Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement. Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes. Experience with high-precision die/fiber attach equipment from major vendors. Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone). Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration). Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances. Ability to read/interpret optical/mechanical engineering drawings and specs.
PREFERRED: Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house. Exposure to active alignment and optical feedback systems.
