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Lumilens is building photonics infrastructure for AI supercomputing, developing chip-to-chip optical interconnects and scalable photonic engines. The company is Series B funded and led by veterans from transformative technology companies.
You will serve as the primary engineering interface between Lumilens' hardware design teams, package manufacturing teams, and worldwide suppliers. This hands-on role focuses on Design for Manufacturing (DFM) and Design for Reliability (DFR) of optical transceiver manufacturing processes, spanning SMT, die attach, wire bonding, flip chip, TCB bonding, underfill, FAU active alignment, mechanical assembly, and reliability testing.
Key responsibilities include leading DFM/DFR efforts across various transceiver designs (pluggable, NPO, and CPO architectures), conducting capability assessments and risk analysis for processes, machines, and materials, engaging with packaging production teams during early process development, and collecting/summarizing data to support manufacturing decisions.
You will work cross-functionally with substrate design, optical design, chip design, production line, NPI line, and component/material suppliers during early development phases. The ideal candidate combines deep expertise in materials, chemistry, mechanical, electrical, and optical engineering with a passion for manufacturing process excellence and global-scale execution.
Required: B.S. or M.S. in Materials, Chemistry, or Mechanical Engineering with 10+ years in transceiver assembly process development or similar high-reliability manufacturing. Deep knowledge of materials (solder, epoxy, glass, ceramic), equipment (SMT, die bonders, active aligners, TCB bonding), and components (FR4, PIC chips, EIC chips, FAU, SMD). Proficiency with Cadence, Solidworks, and JMP. Familiarity with FMEA, Control Plans, SPC, and 8D methodologies. Fluent English (speaking, writing, listening).
