SlipstreamJobs tracks this role from the company's public career site. Apply directly on the employer's site.
Salary: CAD 140,000 - 180,000 / annual
Xanadu is building quantum computers that are useful and available globally. The company's mission is to develop technologies that solve the world's most challenging problems through quantum computing innovation.
In this role, you will join the Hardware Team in Toronto and apply your expertise in mechanical design, thermal management, and complex systems to Xanadu's rack-scale quantum computer development. You will bridge facility-level infrastructure design with chassis-level mechanical packaging, modeling and sizing key rack infrastructure components (CDUs, PDUs, liquid manifolds, fiber managers) while owning the mechanical design of sub-system modules that integrate directly into the racks. You will take mechanical ownership of the world's first photonic quantum computers deployed at scale.
Key responsibilities include:
- Design and optimize rack-scale infrastructure for thermal and mechanical performance
- Conduct system-level thermal and hydraulic sizing for cooling and power distribution systems
- Perform thermal simulations (CFD/FEA) to achieve precise temperature stability and low vibration
- Apply GD&T and tolerance stack-up analysis for complex assemblies with blind-mate connections
- Own mechanical packaging design including sheet metal, machined components, and structural frames
- Collaborate with cross-functional teams (photonic, electrical, optical, software engineers)
- Take end-to-end mechanical ownership of complex hardware deliverables
Requirements:
- BSc or higher in mechanical engineering or related discipline
- 5+ years of industry experience in data center thermal/mechanical systems engineering
- Proficiency in system-level thermal and hydraulic sizing, including CDUs, PDUs, manifolds, and liquid cooling loops
- Hands-on experience with thermal simulations (CFD/FEA) for temperature stability and heat distribution
- Proficiency in GD&T (ASME Y14.5) and tolerance stack-up analysis for complex assemblies
- Deep familiarity with mechanical packaging (sheet metal design, machined components, structural frames, quick-disconnect fittings)
- Self-motivated, adaptable, comfortable working independently and collaboratively
- Strong interpersonal and technical communication skills
- Track record of taking end-to-end mechanical ownership of complex hardware
Preferred qualifications:
- MSc in mechanical engineering or related discipline
- 8+ years combined academic and industry experience, including 3+ years leading mechanical packaging or data center infrastructure projects
- End-to-end experience specifying or designing rack-scale infrastructure with CDUs, secondary fluid loops, manifolds, and Intelligent PDUs
- Proven track record in sub-system module packaging with complex mechanical assemblies (50+ unique parts)
- Experience with customized rack frameworks (EIA-310, OCP, or custom standards) including structural load analysis
- Advanced thermal and hydraulic modeling using CAD and CFD tools (Ansys Icepak, SimScale, FloTHERM)
- Expertise in passive and active vibration mitigation for optical/photonic paths
- Expert-level CAD and CAM software proficiency
- Hands-on experience with CNC machining, 3D printing, and manufacturing techniques
- Experience with high-volume sheet metal stamping and DFM principles
- Experience specifying or designing production rack-scale electrical power distribution
