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d-Matrix is seeking an experienced Thermal Engineer to lead end-to-end thermal design, architecture, and validation of next-generation AI XPU computing platforms. The role spans silicon-level thermal management, server-level chassis engineering, and full 100kW+ liquid-cooled rack deployments.
You will own the thermal-fluid design of air-cooled and liquid-cooled systems, including cold plates, rack manifolds, tubing, and Coolant Distribution Units (CDUs), ensuring balanced flow, low pressure drop, and high reliability. Key responsibilities include:
- Lead thermal-fluid design and development of liquid cooling hardware, including high-TDP XPU cold plates, rack manifolds, quick disconnects (UQDs), and tubing networks
- Define and select liquid cooling infrastructure, including internal and external CDUs
- Perform fluid dynamics and flow network analysis to balance flow, minimize pressure drop, and prevent flow starvation across multi-chassis racks
- Evaluate fluid compatibility, materials, corrosion inhibitors, and long-term reliability of closed-loop cooling circuits
- Design and optimize air-cooled thermal solutions, including heat sinks, fans, ducting, chassis airflow, and VRM/memory cooling
- Build 3D CFD models and 1D hydraulic network simulations to predict junction temperatures, thermal resistance, fluid temperatures, and rack-level pressure drop
- Architect thermal/fluid lab setups, instrument test vehicles and chassis with thermocouples, RTDs, pressure transducers, flow meters, and multi-channel DAQ systems
- Execute performance testing of cold plates, manifolds, CDUs, and server/rack systems under varied workloads and ambient conditions
- Partner with Mechanical, Electrical, Packaging, and Reliability teams to integrate thermal components into production-ready AI servers and racks
The company is focused on unleashing the potential of generative AI through software and hardware innovation, with a culture emphasizing respect, collaboration, humility, and direct communication.
REQUIREMENTS:
- Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or related discipline
- 7+ years of hands-on experience in thermal design, CFD modeling, and physical testing of air-cooled and liquid-cooled electronic systems
- Demonstrated expertise in designing, selecting, and qualifying cold plates, rack manifolds, fluid tubing, UQDs, and CDUs
- Deep understanding of flow networks, pressure drop calculations, hydraulic balancing, and fluid distribution across multi-socket, multi-tray server racks
- Knowledge in air-cooled thermal management, including fan selection, heat sink design, and system impedance testing
- Experience with CFD tools such as Simcenter Flotherm, Flotherm XT, Ansys Icepak, or Ansys Fluent
- Knowledge of lab instrumentation, including multi-channel DAQs (e.g., Keysight, Graphtec), thermal test vehicles (TTVs), flow benches, pressure calibration, and helium/pressure leak testing
- Proven experience performing hands-on performance characterization and stress testing of liquid-cooled hardware
PREFERRED QUALIFICATIONS:
- Experience with 1D hydraulic network simulation tools such as Flownex or Flowmaster
- Proficiency with 3D mechanical CAD tools (e.g., PTC Creo, SolidWorks, Siemens NX) for component modeling and packaging integration
- Familiarity with Open Compute Project (OCP) liquid cooling standards and industry reliability metrics
- Knowledge of thermal interface materials (TIM1, TIM1.5, phase-change materials) and advanced packaging thermal constraints (HBM, interposers, multi-die modules)
