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Salary: USD 146,000 - 194,000 / annual
Anduril Industries is a defense technology company transforming U.S. and allied military capabilities through advanced technology. The Intelligence Systems division focuses on delivering specialized engineering and products for Intelligence Community customers, addressing critical national security requirements.
You will join a rapidly growing team as a Senior PCB Layout Designer responsible for full-cycle PCB design. This encompasses collecting requirements, schematic design, component selection, supervision or completion of layout, bring-up, test, debug, and system integration.
Key responsibilities include:
- Working directly with engineers to produce printed circuit board designs supporting Anduril's products
- Applying modern design standards and guidelines to create high-reliability, highly manufacturable assemblies
- Implementing combinations of high-speed digital, precision analog, RF, and high-power designs
- Assisting the team in establishing internal guidelines for design for manufacturing (DFM), design for assembly (DFA), and overall quality fabrication and assembly outputs
- Refining team processes for PCB design, part creation, and library/database standards
- Coordinating external PCB design resources during design surges
- Working in a fast-paced environment juggling multiple concurrent projects and customers
REQUIREMENTS:
- Associates degree in electrical engineering or similar, plus 8-10+ years of professional experience in PCB Layout design
- Ability to read and interpret schematics and apply best practices appropriate for each design
- Ability to determine work priorities based on broad direction from management
- Expertise in applying relevant IPC standards, CID, CID+ certification
- Expertise in PCB fabrication processes, limitations, design rules, and best practice
- Experience using Altium Designer CAD tools
- Experience with developing component libraries and library management
- Ability to work in team environment, either taking direction or giving direction to complete design quickly
- Excellent communication skills with multiple fab houses (ensuring boards are built to print)
- Experience with a variety of board types, including high density and high layer count (greater than 16) digital designs, power electronics, flex circuits, and RF circuits
- Experience with HDI (high density interconnect) and thicker boards (greater than 1.6mm)
- Familiarity with basic signal and power integrity rules and their effect on layout
- Eligible to obtain and maintain an active U.S. Secret security clearance
- Experience with high-speed digital interfaces and controlled impedance routing requirements like USB, PCIe, Ethernet
PREFERRED QUALIFICATIONS:
- Experience with dense high-pin count packages (FPGA fanout)
- Experience designing with high-speed digital interfaces, SERDES, and DDR memory structures
- Experience designing with SoC FPGAs
- Experience designing with Siemens Xpedition or Cadence Allegro ECAD tools
- Deep understanding and experience with sequential lam structures
- Experience designing in air-gapped network environments
