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Rigetti Computing is seeking a Senior Mechanical Engineer to architect, design, develop, and optimize advanced hardware systems for next-generation quantum computing platforms. In this role, you will lead the mechanical design and integration of hardware that enables RF signal delivery and silicon device packaging within dilution refrigerators—the critical interface between room-temperature control electronics and ultra-low-temperature environments where superconducting qubits operate.
You will be responsible for the senior mechanical design of complex hardware subsystems including cryostat internal architecture, custom components for the signal chain, and metal enclosures. Key responsibilities include developing and maintaining detailed 3D CAD models, drawings, and Bills of Materials; driving end-to-end design of mechanical interfaces from room temperature down to the millikelvin regime; and designing thermal anchoring and shielding systems optimized for mechanical stability and quantum coherence.
You will perform thermal, vibrational, and structural simulations using FEA tools to ensure performance and robustness, build and validate mechanical/cryogenic prototypes in the lab, and collaborate with quantum physics teams to ensure system-level functionality in live quantum experiments. Working closely with hardware, cryo, RF, and systems teams, you will deliver integrated, scalable quantum hardware platforms. Additional responsibilities include developing specifications for outsourced components, managing supplier relationships for critical assemblies such as vacuum flanges, cryo fixtures, and RF housings, authoring assembly documentation, and maintaining design traceability in PLM systems.
REQUIREMENTS:
- M.S. degree or higher in Mechanical Engineering or equivalent field
- 7+ years of industry experience in mechanical design and systems engineering
- Proficiency with 3D CAD software (SolidWorks preferred)
- Strong background in tolerance analysis and GD&T principles
- Experience in thermal and structural modeling and simulation
- Familiarity with documentation control, revision management, and PLM tools
- Excellent cross-disciplinary communication and project collaboration skills
- Demonstrated ability to develop and document assembly processes
PREFERRED QUALIFICATIONS:
- Familiarity with thermal-mechanical effects in cryogenic materials and multi-physics system design
- Experience with RF packaging and electronic device integration in cryogenic or vacuum environments
- Quality assurance experience including inspection methodologies and non-conformance resolution
- Hands-on machining or fabrication experience to support rapid prototyping and design iteration
