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Salary: USD 130,000 - 180,000 / annual
fab2 is building the complete hardware and software stack for semiconductor fabrication, including fabs, tools, and components. The company was founded by Sam Zeloof (known for making chips in his garage) and Jim Keller (40-year semiconductor industry veteran).
As an Optomechanical Engineer, you will own the full development lifecycle of optomechanical systems for semiconductor packaging, from concept through operation. You'll design and build laser-based systems and processes for fabricating advanced packaging devices, working hands-on across mechanical design, optical layout, precision assembly, controls integration, alignment, and debugging.
Key responsibilities include:
- Developing laser micromachining processes and equipment with vision-based alignment and inspection systems
- Creating and validating novel IC packaging processes, from early experiments through repeatable multi-step flows
- Planning and executing experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes
- Collaborating with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware
- Maintaining design documentation, experiment records, operating procedures, and equipment maintenance requirements
This is a hands-on role in a fast-moving R&D environment where you'll take ownership from initial concept through functional hardware and validated process results.
REQUIREMENTS:
- Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
- Experience with optomechanical system design and integration (mechanical design, optics, precision assembly, wiring, controls, alignment, system debug)
- Experience developing laser micromachining processes and working with vision-based alignment systems
- Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance
- Ability to work independently in a fast-moving R&D environment and take ownership from concept through functional hardware
NICE-TO-HAVE:
- Experience with metal plating
- Exposure to advanced semiconductor packaging technologies (interposers, through-vias, redistribution layers, hybrid bonding, thermocompression bonding, flip chip, underfill)
- Experience with ultrafast laser micromachining
