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Tenstorrent is seeking a Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role bridges packaging engineering, silicon manufacturing, quality, supply chain, and external partners including substrate suppliers, OSATs, test houses, and contract manufacturers.
You will focus on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness.
Key responsibilities include:
- Translating package requirements into executable assembly process flows, manufacturing specifications, control plans, inspection requirements, acceptance criteria, and complete manufacturing documentation
- Leading factory commissioning, line bring-up, pilot and engineering builds, qualification lots, first article and reliability activities, and mass-production readiness reviews
- Establishing process capability and performance targets (Cp/Cpk, yield, FPY, defect rates, test escapes, cycle time, OEE, on-time delivery) using SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving
- Owning technical issue resolution and controlled change implementation across silicon, package, assembly, test, and factory operations, including nonconforming material, MCOs, ECOs, supplier and material changes, and requalification
- Working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners
The role is remote-based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, and contract manufacturers across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities.
Tenstorrent is a leader in cutting-edge AI technology, developing high-performance RISC-V CPUs and AI platforms. You will learn how the company scales advanced silicon, package, test, and system manufacturing through a global OSAT and manufacturing-partner ecosystem, and how to lead process transfer, factory commissioning, qualification, and production ramp for complex compute products.
REQUIREMENTS:
- 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or closely related environment
- Experience with semiconductor assembly, package manufacturing, package test, board assembly, final product manufacturing, or taking a package, assembly process, or manufacturing line from development through sustaining operations
- Comfortable working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners
- Data-driven problem solver and strong communicator who can interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation while driving decisions across engineering, operations, quality, and suppliers
Note: Candidates will be assessed for appropriate level during the interview process; offers will align with assessed level, which may differ from the posting level.
