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onsemi is seeking a Unit Process Development (UPD) Engineer specializing in Etch Process Development for wide bandgap (SiC) power technologies. This is a hands-on, critical role within the operations organization focused on designing and optimizing new SiC power technologies to be manufacturable, cost-competitive, and high-quality.
You will work primarily at the Bucheon, Korea manufacturing facility and interface regularly with the Bucheon Korea manufacturing team, Power Solution Group (PSG) technology development teams, PSG new product and test engineering organizations, and Corporate Quality organizations. The role requires both independent work and strong collaboration within cross-functional teams.
Key responsibilities include:
- Identify operational gaps and serve as a strong team member within the unit process development engineering organization, driving technology development from feasibility through production ramp
- Develop capable processes aligned with unified technology design rules
- Ensure complete process characterization for each technology node, including process monitoring and intrinsic/extrinsic reliability for power devices, collaborating with process integration and device engineering teams
- Participate as the operations representative in due diligence projects for wide bandgap power products
- Own process development and qualification through collaboration with process integration and device engineers to successfully qualify and ramp wide bandgap products
- Improve yield and cost by securing wide process windows and driving process defect reduction as a process owner
- Enhance tool capability through deep understanding of tool functionality and collaboration with equipment engineering teams on Continuous Improvement Projects (CIPs)
The successful candidate will possess analytical and proven semiconductor process integration skills to identify and solve problems, demonstrate strong ownership, and drive improvement across all aspects of new technology from pathfinding to production ramp.
REQUIREMENTS:
- Minimum 3 years of hands-on experience in semiconductor engineering, specifically in Dry Etch process
- Minimum 3+ years of hands-on experience in 8" fab with at least 0.25 µm technology node experience
- Experience with wide bandgap technologies
- Demonstrated success developing and ramping a technology to at least 1,000 wafers per week
- Experience working with and leading cross-functional teams across remote/distributed factories
- Proven ability to drive changes
- Advanced degree preferred in semiconductor processing, device physics, or compatible disciplines
- Willing to travel up to 20% of the time as required
- Based in Bucheon, Korea as main work site
