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Lumilens is seeking a Senior Process Engineer to lead silicon photonic wafer processing development, focusing on backside grinding, laser stealth dicing, and die sorting for advanced silicon photonic chips. This role bridges manufacturing engineering and product development, requiring deep expertise in backend wafer processing and a track record of solving complex yield and quality challenges.
You will own the optimization of wafer thinning thickness, grinding speed, cutting paths, and laser cutting parameters to prevent chip cracking, edge chipping, and damage to optical structures. You'll diagnose and resolve process abnormalities including wafer warpage, surface scratches, incomplete cuts, and chip breakage. A key responsibility is monitoring wafer thickness uniformity, cutting quality, and production capacity while driving continuous process improvements to enhance yield.
You will evaluate process compatibility between wafer grinding/stealth dicing and downstream bumping and flip-chip processes, optimizing integration to prevent failures caused by front-end process variations. You'll work closely with external equipment and material suppliers to develop and qualify new equipment and materials needed for advanced assembly requirements, bringing processes from development through mass production.
Additionally, you will compile process SOPs, work instructions, failure reports, and engineering change documents; support new product introduction (NPI) and process verification activities.
REQUIREMENTS:
- Bachelor's or Master's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or equivalent technical discipline
- 3 to 6+ years of hands-on process engineering experience in wafer mounting, wafer dicing, wafer thinning, or grinding, with demonstrated experience handling advanced packaging wafers with complex topology or stack configurations
- Proven experience working with external equipment and material suppliers to develop, characterize, and qualify new equipment and materials for advanced assembly requirements, bringing processes to mass production
- Familiarity with SPC (Statistical Process Control), JMP data analysis, and DOE (Design of Experiments) matrix design for process development, problem identification, and systematic problem-solving
