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Salary: USD 185,000 - 250,000 / annual
Positron AI develops custom hardware systems that accelerate AI inference, delivering step-function gains in performance per dollar and performance per watt over GPU-centric approaches.
As a Senior Mechanical Engineer, you will own the mechanical, thermal-mechanical, and enclosure design of Positron's AI inference platforms—from carrier-board mechanical integration and chassis design through rack-level packaging of Asimov-based systems. You will ensure that structural, thermal, and manufacturability characteristics of high-power hardware meet the demands of high-density HPC and data center environments, and serve as the primary mechanical interface to contract manufacturers and custom-part fabricators.
Key Responsibilities:
• Mechanical Design Ownership: Own the mechanical design of enclosures, chassis, and carrier-board mechanical integration for rack-mount (1U/2U) inference systems—including spatial studies, conceptual and detailed design, solid models, drawings, BOMs, and tolerance stack-up analysis.
• Thermal & Structural Analysis: Lead thermal-mechanical and structural design and simulation for high-TDP ASIC platforms—heatsinks, cold plates, retention hardware, airflow, and shock/vibration—partnering with electrical and thermal teams to meet air- and liquid-cooled performance targets.
• Manufacturer Engagement: Act as the primary mechanical lead and Positron representative for contract manufacturers, ODMs, and custom-part fabricators (sheet metal, injection molding, die casting, MIM, cable) through EVT, DVT, pilot, and production ramp.
• DFx & Cost Reduction: Lead detailed DFM/DFA reviews—tolerances, assembly sequence, poka-yoke, part reduction and standardization, and DFMEA—to reduce unit cost and improve design robustness.
• Fixtures & Packaging: Develop and qualify custom electromechanical fixtures supporting assembly and test, and own product packaging design, transit qualification, and implementation.
• Validation & Governance: Own mechanical test-plan creation (structural, thermal, environmental), support EMC/EMI shielding and regulatory needs, and manage the mechanical risk register, ECOs, and technical escalations to keep programs on schedule for pilot and manufacturing ramps.
This is a high-impact role requiring deep expertise in electromechanical design for high-performance electronic systems and the ability to drive designs from concept through volume production with external partners. The company is growth-oriented and open to hiring at a more senior level for the right candidate; specific responsibilities will be tailored to the experience and seniority of the final hire.
Required Qualifications:
• BS/MS in Mechanical Engineering and 7+ years designing electromechanical and enclosure hardware for high-performance electronic systems, spanning the full NPI lifecycle from concept through volume production.
• Proven expertise in 3D CAD (SolidWorks and/or Creo), detailed drawings and GD&T, tolerance stack-up analysis, and structural/thermal simulation (e.g., SolidWorks Simulation/Flow, Ansys).
• Experience with rack-mount or high-density electronic packaging, and direct experience selecting, qualifying, and managing custom-part suppliers and contract manufacturers—including global partners—through EVT/DVT/pilot phases.
• Demonstrated track record applying DFM/DFA and FMEA to drive cost, quality, and manufacturability in high-volume or high-complexity production environments.
• Strong ability to write clear mechanical specifications and communicate trade-offs across electrical, thermal, ASIC, firmware, and operations teams.
Preferred Qualifications:
• Background in mechanical and thermal design for AI/ML accelerators, servers, or other high-power data center hardware.
• Experience correlating CFD and thermal-mechanical simulations to real-world air- or liquid-cooled performance (heatsinks, cold plates, manifolds).
• Experience driving hardware through EMC/EMI shielding, environmental qualification (shock, vibration, thermal), and packaging/transit testing; familiarity with FCC/CE and RoHS/REACH.
• Certifications such as Certified SolidWorks Professional, Ansys, DFMA, or packaging qualification (ISTA); relevant patents; and business/finance acumen (e.g., an MBA) connecting design decisions to cost and profitability.
