SlipstreamJobs tracks this role from the company's public career site. Apply directly on the employer's site.
SWIR Vision Systems (part of onsemi, Nasdaq: ON) is seeking a Staff Engineer for Package Development to lead innovation in semiconductor packaging technology. This role spans the full lifecycle of new package development—from conceptualization and ideation through prototype creation and production transfer.
Key responsibilities include:
- Conceptualize and develop new packaging solutions from ideation to fully functional prototypes
- Identify and establish partnerships with proof-of-concept (POC) labs, equipment providers, material suppliers, and service providers
- Conduct POC builds and technology demonstrations, benchmarking against provider processes and technologies
- Develop costing estimates and project timelines for POC initiatives
- Follow established New Package Technology Development processes and H3 Ideation Flow
- Ensure intellectual property coverage prior to external engagement
- Generate and present POC and technology demonstration reports to stakeholders
- Manage technology transfer to development and manufacturing sites
- Provide market and technology intelligence on packaging innovations
- Conduct design reviews and risk assessments with cross-functional technical experts
- Independently determine technical approaches for problem-solving while working with general guidance
- Manage technical project risks and deploy mitigation actions to meet committed timelines
- Collaborate closely with Manufacturing, Reliability, and Business Units to resolve engineering gaps and ensure smooth production transfer
- Conduct materials and assembly testing and research
The role requires strong analytical capabilities, hands-on experience with assembly development and manufacturing processes, and the ability to work independently on complex technical challenges. onsemi is focused on automotive, industrial, and infrastructure markets, driving innovations in vehicle electrification, sustainable energy, industrial automation, and 5G/cloud infrastructure.
Requirements:
- Bachelor's or Master's degree in Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, or Electronics and Communications Engineering
- 8+ years of experience in semiconductor manufacturing, with particular focus on new package/product development
- Hands-on assembly development and manufacturing experience
- Strong analytical skills in process, materials, and assembly equipment parameters
- Hands-on experience in program management
