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Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following a $200M Series B at $1.4B valuation, the company is expanding teams to deliver mission-critical systems to allied forces.
You will join the R&D team as an Embedded Electrical Engineer, owning the design of compute modules and associated boards used across the company's platforms. This role combines demanding high-speed design work with hands-on bench work, taking hardware from first prototype through to flight-qualified boards.
Key responsibilities include:
- Design SoMs, baseboards, and test boards for compute platforms
- High-speed digital design around application processors (PCIe, 10 Gb Ethernet, USB 3.x, MIPI) with layout constraints and signal integrity management
- Power tree design, sequencing, and conversion topologies with verified power-up/power-down behavior
- Preparation and leadership of design reviews from block diagram through fabrication release
- Collaboration with PCB and EMS partners on stack-up, via technology, layout guidance, and cost trade-offs
- Definition of verification test plans, board troubleshooting and characterization, and thermal, vibration, EMC, and ESD qualification
- Cross-functional work with embedded software teams during bring-up, mechanical teams on form factor and thermal constraints, and validation for flight qualification
The role operates in a demanding environment where rigor, ownership, and execution are expected. You will work autonomously and see boards from concept through production.
REQUIREMENTS:
- Educational Background: MSc in electrical, computer, or related engineering field (PhD a plus); hands-on design and bring-up record valued highly
- Experience: Minimum 5 years in embedded hardware design, with boards taken from specification through bring-up and qualification into production
- Technical Expertise: High-speed design including layout constraints, signal integrity, and validation; systems built around processors with external memory (DDR, Flash) carried through to committed layout; power trees with deliberate conversion topologies and verified power-up/power-down behavior
- Tools: In-depth knowledge of electronic CAD tools (e.g., Altium)
- Testing Proficiency: Proficiency with electronic test equipment and experience planning thermal, vibration, EMC, and ESD qualification
- Manufacturing: Experience working with fabrication and assembly partners on stack-up, via technology, and cost trade-offs
- Problem Solving: Rigorous, structured, analytical approach; ability to work autonomously
- Communication: Excellent written and verbal communication; ability to present design and test results to engineers and senior stakeholders
- Advantageous: FPGA or MPSoC design, prior work deploying AI inference on embedded targets, UAS/drone/defense hardware experience
