SlipstreamJobs tracks this role from the company's public career site. Apply directly on the employer's site.
Salary: USD 129,000 - 171,000 / annual
Anduril Industries is seeking an Electromechanical Integration Engineer to join the Air Dominance & Strike team, responsible for mechanical packaging, interconnect architecture, and structural integration of avionics, power systems, and electro-optical payloads across Group 5 aircraft and high-speed missiles. You will own the full development lifecycle from concept through qualification and flight operations, delivering rugged, high-performance electromechanical systems optimized for Size, Weight, Power, and Cost (SWaP-C).
Key responsibilities include:
- Design flight-critical enclosures, chassis, and mechanical packaging for high-density circuit card assemblies, battery systems, electro-optical payloads, and cable/harness assemblies
- Collaborate with electrical engineers to inform PCBA layout, define connector configurations, manage keep-out zones, route harnesses, and establish thermal and grounding interfaces
- Create detailed 3D models, drawing packages, GD&T and tolerance stack-up analyses to ensure designs are optimized for assembly, serviceability, and high-yield manufacturing
- Conduct hand calculations and structural FEA, working with thermal and fatigue analysts to validate performance before committing to physical hardware
- Design hardware to survive aerospace environments—vibration, shock, thermal extremes, moisture, and EMI/EMC—meeting standards such as MIL-STD-810, MIL-STD-464/461, and DO-160
- Lead root-cause investigations and corrective actions for mechanical, environmental, or manufacturing anomalies found during qualification or flight operations
- Support design reviews (PDR/CDR) and drive execution of engineering deliverables across distributed, cross-functional teams including systems, hardware, software, manufacturing, test, and supply chain
REQUIREMENTS:
- B.S. or higher in Mechanical Engineering, Mechatronics, Aerospace Engineering, or equivalent experience
- 4+ years of experience in electronics packaging and/or electromechanical systems design in aerospace, defense, automotive, or robotics
- Direct experience designing hardware to MIL-STD-810 and MIL-STD-464/461 environmental and EMI/EMC standards
- Proficiency with 3D CAD (Siemens NX, SolidWorks, CATIA, or similar) for complex surface modeling, enclosure packaging, and harness routing
- Understanding of advanced manufacturing processes including CNC machining, sheet metal fabrication, casting, injection molding, and 3D printing, with hands-on prototyping experience
- Strong communication, collaboration, and teamwork skills across multi-site, multi-disciplinary teams
- Eligible to obtain and maintain an active U.S. Secret security clearance
PREFERRED QUALIFICATIONS:
- Extensive experience with Siemens NX and Teamcenter
- Familiarity with eCAD tools (Altium, Cadence Allegro) and harness design software (Siemens Capital, Zuken E3)
- Practical understanding of bare-board PCB manufacturing, high-density interconnect (HDI) stackups, and SMT assembly standards (IPC-A-610/J-STD-001)
- Advanced FEA and thermal simulation experience with tools such as Ansys Mechanical, Ansys Icepak, FloTHERM, or Ansys Sherlock
- Experience designing battery modules/packs or precision-aligned electro-optical/sensor payloads
- Active Top Secret DoD clearance
