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Fractile is an AI infrastructure company founded in 2022, building specialized chips and systems to accelerate inference speed for frontier AI models. The company has raised $220M from top-tier investors including Founders Fund and Accel.
You will serve as Fractile's primary technical interface with DRAM suppliers, based in Taiwan. This is a hands-on engineering role bridging silicon design, quality, and operations teams to move DRAM devices from development through qualification and into volume production.
Key responsibilities include:
- Owning the technical manufacturing relationship with DRAM suppliers, ensuring clear requirements and production readiness
- Translating device requirements into manufacturing specifications, test coverage, and acceptance criteria in collaboration with design teams
- Reviewing DRAM architecture and circuit implementation at the gate and transistor level, including memory cells, access transistors, sense amplifiers, decoders, and peripheral logic
- Applying deep knowledge of DRAM operations (activation, sensing, restoration, precharge, refresh, read/write) to assess device behavior and investigate failures
- Defining and reviewing comprehensive test strategies covering wafer probe, packaged-device testing, characterization, qualification, and production screening
- Working with the Manufacturing Test Team to ensure test programs cover functional, parametric, timing, retention, coupling, and disturb-related failures across voltage, temperature, and frequency conditions
- Assessing effects of redundancy, repair, and on-die ECC on test coverage
- Analyzing wafer maps, bit-failure maps, yield trends, and characterization data to identify root causes and drive corrective actions
- Establishing correlation between supplier test results and Fractile's device and system evaluation
- Driving improvements in yield, outgoing quality, and test efficiency during volume production
- Assessing and managing supplier process, material, and test-program changes
- Providing internal teams with clear visibility of technical risks, qualification progress, and manufacturing readiness
You will work directly with top leadership on ambitious timelines, have full agency to drive work forward, and collaborate across hardware, software, silicon, and modeling teams.
REQUIREMENTS:
Essential:
- Substantial hands-on experience in DRAM manufacturing, product engineering, test engineering, or device characterization
- Direct experience with DDR5 DRAM development, qualification, or production testing
- Deep understanding of DRAM structure and operation at gate and transistor level, including memory-cell behavior and analog sensing circuits
- Practical experience selecting and implementing DRAM test strategies
- Understanding of how process variation and manufacturing defects affect DRAM performance, power, retention, reliability, and yield
- Ability to interpret circuit schematics, device specifications, timing diagrams, and failure signatures
- Experience working directly with DRAM suppliers and driving technical issues to resolution
- Ability to work independently, prioritize competing issues, and make sound engineering decisions in a growing company
- Strong English communication skills
- Degree in electrical engineering, electronics, semiconductor physics, or related discipline, or equivalent industry experience
Desirable:
- Custom DRAM development and new product introduction experience
- DRAM redundancy analysis, repair flows, and on-die ECC evaluation
- Reliability qualification, burn-in, and accelerated stress testing
- Statistical analysis and scripting using Python, JMP, or similar tools
- Mandarin language skills
