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Salary: USD 180,000 - 270,000 / annual
Delos Data is a venture-backed startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. The company is led by experienced founders and operators with successful track records and is headquartered in Silicon Valley with distributed operations across the US and Canada.
You will serve as a Principal Package Engineer responsible for architecting and delivering advanced multi-die IC packages for high-performance AI accelerators. This is a technical leadership role focused on package architecture, substrate design, manufacturability, and vendor engagement at the system level.
Key responsibilities include:
- Selecting and designing optimal multi-die package types (MCM, 2.5D, 3D, fan-out, CoWoS, InFO, CPC, CPO) while balancing electrical performance, thermal behavior, cost, and manufacturability
- Defining package specifications, bump maps, ball maps, interposer requirements, and mechanical constraints
- Designing substrate stack-ups, bump pitch, ball pitch, routing, via structures, and material choices
- Performing high-speed signal escaping, routing, and power distribution network design
- Managing subcontractors and working directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows
- Partnering with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system-level needs
- Evaluating emerging packaging technologies and driving adoption for next-generation products
- Supporting package-level bring-up, failure analysis, debug, and qualification
Required Qualifications:
- B.S. or M.S. in Electrical Engineering or related field
- Experience with multi-die package design and UCIe (AP/SP) integration
- Understanding of substrate materials, stack-ups, and mechanical constraints
- Familiarity with SI/PI concepts to collaborate effectively with electrical teams
- Experience managing packaging subcontractors
- Experience interfacing with TSMC/OSAT for bumping and packaging options
- Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus
